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China Factory for China CNMI Epoxy Resin crystal clear for coating small casting river table jewelry crafts jewelry tray coaste
“Based on domestic market and expand overseas business” is our development strategy for China Factory for China CNMI Epoxy Resin crystal clear for coating small casting river table jewelry crafts jewelry tray coaste, You may obtain the least expensive price here. Also you will get premium quality items and fantastic services here! Please never wait to get hold of us!
“Based on domestic market and expand overseas business” is our development strategy for China Epoxy resin, non toxic epoxy resin, With the principle of win-win, we hope to help you make more profits in the market. An opportunity is not to be caught, but to be created. Any trading companies or distributors from any countries are welcomed.
Applications Images
Benzoxazines Resin
Low-DK Benzoxazine Resin series
Bisphenol A epoxy resin series
Bisphenol F epoxy resin series
Phenolic epoxy resin series
Phosphorus containing epoxy resin series
Brominated epoxy resin series
MDI modified epoxy resin series
Macromolecular epoxy resin series
DCPD epoxy resin series
Multifunctional epoxy resin series
Crystalline/liquid crystal epoxy resin series
Phenol Formaldehyde Resin series
Phosphorus containing phenolic resin series
Modified hydrocarbon resin series
Hydrocarbon resin composition series
Active Ester
Special Resin Monomer
Maleimide Resin series
Benzoxazines Resin
Our company is the first company to realize the mass industrial production of Benzoxazine Resin in China, and is in the leading position in the production, application and research fields of Benzoxazine Resin. Benzoxazine Resin products of our company have passed SGS detection, and they do not contain halogen and RoHS (Pb, CD, Hg, Gr (VI), PBBs, PBDEs) harmful substances. The characteristic is that there is no small molecule released during the curing process and the volume is almost zero shrinkage; The curing products have the characteristics of low water absorption, low surface energy, good UV resistance, excellent heat resistance, high residual carbon, no need of strong acid catalysis and open-loop curing.lt is widely used in electronic copper clad laminates, laminates, composite materials, aerospace materials, friction materials and other fields.
|
Name |
Grade No |
Appearance |
softening point (°C) |
Free Phenol (%) |
GT (s @210℃） |
Viscosity |
N.V. (%) |
properties |
|
MDA type Benzoxazine |
DFE125 |
Brownish red transparent liquid |
- |
≤ 5 |
100-230 |
30-70 (s,4# 杯） |
70±3 |
High Tg, high heat resistance, halogen-free flame retardant, high strength and toughness |
|
BPA type Benzoxazine |
DFE127 |
Yellow transparent liquid |
- |
≤ 5 |
1100-1600 |
200-800 Mpa·s |
80 土 2 |
High modulus, high heat resistance, halogen-free flame retardant, low water absorption |
|
BPA type Benzoxazine |
DFE127A |
Yellow solid |
60-85 |
≤ 5 |
500-800 |
- |
98±1,5 |
High modulus, high heat resistance, halogen-free flame retardant, low water absorption |
|
BPF type Benzoxazine |
DFE128 |
Brownish red transparent liquid |
- |
≤ 5 |
350-400 |
30-100 (s，4# 杯） |
75±2 |
Good toughness, high heat resistance, halogen-free flame retardant, low water absorption and low viscosity |
|
ODA type Benzoxazine |
DFE129 |
Brownish red transparent |
- |
≤ 2 |
120-500 |
<2000 mpa.s |
65 土 3 |
Tg: 212°C, Free PlienoK≤ 2%， Dk： 2.92, Df： 0.0051 |
Low-DK Benzoxazine Resin series
Low dielectric Benzoxazine Resin is a kind of Benzoxazine Resin developed for high frequency and high speed copper clad laminate. This kind of resin has the characteristics of low Dk / DF and high heat resistance. It is widely used in M2, M4 grade copper clad laminate or HDI board, multilayer board, composite materials, friction materials, aerospace materials and other fields.
|
Name |
Grade No |
Appearance |
softening point rc> |
Free Phenol (%) |
GT (s @210℃） |
Viscosity |
N.V. (%) |
properties |
|
Low dielectric benzoxazine |
DFE130 |
Yellow granular or massive solid |
55-80 |
≤ 5 |
400-600 |
— |
≥98.5 |
Dk: 2.75、Tg:196℃： |
|
Rapid curing of benzoxazine at medium and low temperature |
DFE146 |
Brownish yellow transparent liquid |
- |
≤ 5 |
100-130 |
<200 (s，4# 杯） |
75±2 |
Dk： 3.04, Df： 0.0039 High curing speed, high Tg and low dielectric |
|
Benzoxazine with double bond |
DFE148 |
Brownish red transparent liquid |
- |
≤ 5 |
Actual measurement |
<2000 Mpa·s |
80±2 |
It can react with other resins containing double bond |
|
Main chain benzoxazine |
DFE149 |
Brownish yellow transparent liquid |
- |
≤ 3 |
80-160 |
<2000 Mpa·s |
70 土 2 |
Tg： 215#C, Td5%： 380°C, Dk： 2.87, Df： 0.0074 (10GHz) |
|
DCPD type Benzoxazine |
DFE150 |
Reddish brown transparent liquid |
- |
≤ 3 |
2000-2500 |
<1000 Mpa·s |
75±2 |
Dk： 2.85, Df： 0.0073 (10GHz) |
|
Bisphenol benzoxazine |
DFE153 |
Brownish yellow transparent liquid |
一 |
≤ 3 |
100-200 |
<2000 Mpa·s |
70±2 |
Dk： 2.88, Df： 0.0076 (10GHz) , |
Bisphenol A epoxy resin series
Bisphenol A epoxy resin of our company includes liquid epoxy resin, solid epoxy resin and solvent epoxy resin, which has low hydrolysis chlorine and is widely used in coatings, electronic materials, composite materials and other fields.
|
Name |
Grade No |
EEW (g/eq) |
Color (G) |
Viscosity (mPa.s) |
Hy-Cl (ppm) |
|
Liquid bisphenol A epoxy resin |
DFE1126 |
165-175 |
≤0.5 |
3000-5000 |
<200 |
|
DFE1127 |
180-190 |
≤1 |
8000-11000 |
<500 |
|
|
DFE1128 |
184-194 |
≤1 |
12000-15000 |
<500 |
|
|
DFE1128H |
184-194 |
≤1 |
12000-15000 |
<100 |
|
|
Name |
Grade No |
EEW(g/eq) |
Color (G) |
Softening point（℃） |
|
|
Solid bisphenol A epoxy resin |
DFE1011 |
450-500 |
≤1 |
60-70 |
|
|
DFE1901 |
450-500 |
≤1 |
65-75 |
||
|
Name |
Grade No |
EEW (g/eq) |
Color (G) |
Viscosity (mPa.s) |
N.V. (%) |
|
Solution type liquid bisphenol A epoxy resin |
DFE1901EK70 |
450-500 |
≤1 |
2000-5000 |
70±1 |
Bisphenol F epoxy resin series
Bisphenol F epoxy resin has the characteristics of low viscosity, good fluidity and wettability, and our company has independent bisphenol F production technology with sufficient raw materials. Products are widely used in solvent-free coatings, casting, adhesives, insulation materials and other fields.
|
Name |
Grade No |
EEW (g/eq) |
Viscosity (mPa·s) |
Color (G) |
Hy-Cl (ppm) |
|
Liquid bisphenol F epoxy resin |
DFE1160 |
155-165 |
≤1600 |
≤1 |
≤100 |
|
DFE1170L |
165-175 |
2900-3500 |
≤1 |
≤100 |
|
|
DFE1170 |
165-175 |
3500-4500 |
≤1 |
≤100 |
|
|
DFE1170H |
165-175 |
5000-6000 |
≤1 |
≤100 |
|
|
DFE1170K |
165-175 |
5000-6000 |
≤1 |
≤200 |
|
|
Name |
Grade No |
EEW (g/eq) |
Color (G) |
Softening point（℃） |
|
|
Solid bisphenol F epoxy resin |
DFE1701 |
450-500 |
≤1 |
45-55 |
|
|
DFE1702 |
600-700 |
≤1 |
75-85 |
||
|
DFE1703 |
700-800 |
≤1 |
85-95 |
||
|
DFE1704D |
900-1000 |
≤1 |
90-100 |
||
|
DFE1707D |
1300-1700 |
≤1 |
100-110 |
||
Phenolic epoxy resin series
Our phenolic epoxy resins include PNE type, BNE type and CNE type. Their cured products have high crosslinking density, excellent bonding strength, heat resistance and chemical resistance. They are widely used in electronic copper clad laminates, electronic laminates, heat-resistant adhesives, composites, high-temperature coatings, civil engineering and electronic inks.
|
Name |
Grade No |
EEW (g/eq) |
softening point (°C) |
Color (G) |
Hy-Cl (ppm) |
|
PNE type phenolic epoxy resin |
DFE1638 |
171-180 |
36-40 |
≤0.5 |
≤200 |
|
DFE1638S |
171-179 |
36-40 |
≤0.5 |
≤200 |
|
|
DFE1636 |
170-178 |
27-31 |
<1 |
<300 |
|
|
DFE1637 |
170-178 |
31-36 |
<1 |
<300 |
|
|
DFE1639 |
174-180 |
44-50 |
<1 |
<300 |
|
|
DFE1625 |
168-178 |
9000-13000mpa·s |
≤1 |
<300 |
|
|
BNE type phenolic epoxy resin |
DFE1200 |
200-220 |
60-70 |
<3 |
<500 |
|
DFE1200H |
205-225 |
70-80 |
<3 |
<500 |
|
|
DFE1200HH |
210-230 |
80-90 |
<3 |
<500 |
|
|
CNE type phenolic epoxy resin |
DFE1701 |
196-206 |
65-70 |
<2 |
<500 |
|
DFE1702 |
197-207 |
70-76 |
<2 |
<500 |
|
|
DFE1704 |
200-215 |
88-93 |
<2 |
<1000 |
|
|
DFE1704M |
200-215 |
83-88 |
<2 |
<1000 |
|
|
DFE1704ML |
200-210 |
80-85 |
<2 |
<1000 |
|
|
DFE1704L |
207-215 |
78-83 |
<2 |
<1000 |
|
|
Name |
Grade No |
EEW (g/eq) |
Viscosity (mPa.s) |
N.V. (%) |
|
|
Solution type phenolic epoxy resin |
DFE236 |
200-220 |
1000-4000 |
80±1 |
|
|
DFE238 |
170-190 |
200-500 |
80 土 1 |
||
Phosphorus containing epoxy resin series
Phosphorus-containing epoxy resins mainly include three types,namely DOPO type, DOPO-HQtype and DOPO-NQtype. They are excellent in flame retardancy and heat resistance, and have low water absorption and expansion coefficient.They belong to halogen-free flame retardant epoxy resin,and conform to RoHS and WEEE Directive.They are mainly applied in halogen-free flame retardant printed circuit board, electronic copper clad laminate,electrical laminate and other product fields.
|
Name |
Grade No |
Appearance |
N.V. (%) |
EEW (g/eq) |
Viscosity (mPa.s) |
P% (%) |
|
DOPO-HQ modified phenolic epoxy resin |
DFE200 |
Reddish brown transparent liquid |
70±1.0 |
320 ±20 |
<1000 |
2.0±0.1 |
|
DOPO-HQ modified phenolic epoxy resin |
DFE200A |
Reddish brown transparent liquid |
70±1.0 |
275 ±25 |
<1000 |
1.0±0.1 |
|
DOPO-HQ modified phenolic epoxy resin |
DFE200C |
Yellow transparent liquid |
80±1.0 |
255 ±15 |
1000-7000 |
2.0±0.1 |
|
DOPO-HQ modified phenolic epoxy resin |
DFE200D |
Yellow transparent liquid |
80±1.0 |
230±20 |
1000-4000 |
1.0±0.1 |
|
DOPO-NQ modified phenolic epoxy resin |
DFE201 |
Reddish brown transparent liquid |
75±1.0 |
330±30 |
1000-3000 |
2.5 ±0.1 |
|
DOPO-NQ modified phenolic epoxy resin |
DFE201A |
Reddish brown transparent liquid |
75±1.0 |
330 土 10 |
1500-1700 |
2.5 ±0.1 |
|
DOPO modified phenolic epoxy resin |
DFE202 |
Colorless to light yellow transparent liquid |
75 ±1.0 |
315±20 |
1000-3000 |
3.1 〜3.2 |
|
DOPO modified phenolic epoxy resin |
DFE202A |
Reddish brown transparent liquid |
70 ±1.0 |
300±20 |
<2000 |
2.4±0.1 |
|
DOPO modified phenolic epoxy resin |
DFE202B |
Colorless to light yellow transparent liquid |
75±1.0 |
310±20 |
≤3000 |
2.8 〜3.2 |
|
DOPO modified phenolic epoxy resin |
DFE202C |
Clean and transparent liquid |
75±1.0 |
300±20 |
<3000 |
3.1 ±0.1 |
|
DOPO modified phenolic epoxy resin |
DFE202D |
Light yellow transparent liquid |
70±1.0 |
360 土 30 |
≤ 1500 |
2.5 ±0.2 |
Brominated epoxy resin series
Brominated epoxy resins are a kind of halogen flame retardant epoxy resins. Our company produces high bromine content and low bromine content epoxy resin, which have good permeability to glass cloth, excellent flame retardant and heat resistance, and are widely used in the field of non halogen flame retardant copper clad laminate.
|
Name |
Grade No |
Appearance |
N.V. (%) |
EEW (g/eq) |
Viscosity (mPa.s) |
Br% (%) |
|
low bromine content epoxy resin |
DFE271 |
Yellowish brown to reddish brown transparent liquid |
80±1.0 |
250-280 |
200-800 |
11.5±1.0 |
|
DFE274 |
Yellowish brown to reddish brown transparent liquid |
75±1.0 |
280-320 |
200-1500 |
18-21 |
|
|
DFE276 |
Yellowish brown to reddish brown transparent liquid |
75 土 1.0 |
340-380 |
200-400 |
18-21 |
|
|
DFE277 |
Yellowish brown to reddish brown transparent liquid |
80±1.0 |
410-440 |
800-1800 |
18-21 |
|
|
DFE278 |
Reddish brown transparent liquid |
80±1.0 |
410-440 |
800-1800 |
18-21 |
|
|
Name |
Grade No |
Appearance |
EEW (g/eq) |
softening point (°C) |
Br% (%) |
|
|
high bromine content epoxy resin |
DFE270 |
Colorless to yellowish solid |
380-420 |
67-74 |
46-50 |
|
MDI modified epoxy resin series
The MDI modified epoxy resin is a Isocyanate modified epoxy with oxazolidinone embedded in the main chain, which has excellent heat resistance and flexibility. The product is available in Boron free and Boron containing, It is soluble in common solvents such as propylene glycol methyl ether, acetone, butanone, etc. .It has good compatibility with dicyandiamide, phenolic curing agent, and it is suitable for halogen-free lead-free copper clad laminate field.
|
Name |
Grade No |
Appearance |
N.V. (%) |
EEW (g/eq) |
Viscosity (mPa.s) |
Br% (%) |
|
MDI modified brominated epoxy resin |
DFE204 |
Reddish brown transparent liquid |
75±1.0 |
330-370 |
500-2000 |
16.5-18 |
|
DFE204A |
Reddish brown transparent liquid |
75±1.0 |
330-370 |
500-2000 |
16.5-18 |
|
|
MDI modified epoxy resin |
DFE205 |
Yellowish brown transparent liquid |
75 ±1.0 |
250-310 |
500-2500 |
- |
|
DFE205A |
Yellowish brown transparent liquid |
75 ±1.0 |
270-330 |
500-2500 |
- |
Macromolecular epoxy resin series
Macromolecular epoxy resins are a kind of modified bisphenol A/F epoxy resins, which contain flexible molecular skeletons and long molecular chain segments, and have excellent flexibility and adhesion.They are commonly used in epoxy resin systems to increase flexibility and adhesion, and improve resin flowability. They are suitable for printed circuit board, electronic copper clad laminate, adhesive, composite materials, electrical laminate and other products.
|
Name |
Grade No |
Appearance |
N.V. (%) |
EEW (g/eq) |
Viscosity (mPa.s) |
|
Modified bisphenol A epoxy resin |
DFE206 |
Colorless to light yellow transparent liquid |
75 土 1.0 |
470±30 |
500-3000 |
|
Modified bisphenol Fepoxy resin |
DFE207 |
Light yellow to reddish brown transparent liquid |
70±1.0 |
550 ±50 |
500-3000 |
DCPD epoxy resin series
DCPD epoxy resin is a kind of linear multifunctional epoxy resin with low Dk / DF, excellent heat resistance, low humidity, high adhesion and chemical resistance. It is widely used in high frequency and high speed copper clad laminate, molding materials, flame retardant coatings, flame retardant adhesives and other fields.
|
Name |
Grade No |
EEW (g/eq) |
softening point (°C) |
Hy-Cl (ppm) |
|
Solid DCPD epoxy resin |
DFE211LL |
260-275 |
53-60 |
<300 |
|
DFE211L |
265-275 |
60-70 |
<300 |
|
|
DFE211 |
260-280 |
70-80 |
<300 |
|
|
DFE211H |
260-280 |
80-90 |
<300 |
|
|
DFE211HH |
265-285 |
90-100 |
<300 |
|
|
Name |
Grade No |
EEW (g/eq) |
N.V. (%) |
Viscosity (mPa.s) |
|
DCPD epoxy resin solution |
DFE210 |
260-280 |
75±1 |
200-800 |
Multifunctional epoxy resin series
Multifunctional epoxy resin is a kind of epoxy resin with three or four functional degrees. It has the characteristics of high cross-linking density, good heat resistance, fast curing, high strength and excellent chemical resistance. It is widely used in the fields of electronic copper clad laminate and composite materials.
DFE250
DFE254
DFE256
DFE258
|
Name |
Grade No |
EEW (g/eq) |
Color (G) |
Hy-Cl (ppm) |
|
Tetrafiinctional epoxy resin |
DFE250 |
195-230 |
≤18 |
- |
|
High temperature resistant multifunctional epoxy resin |
DFE254 |
110-120 |
<11 |
<1000 |
|
DFE256 |
90-110 |
<11 |
<1000 |
|
|
Trifunctional epoxy resin |
DFE258 |
155-175 |
<18 |
<1000 |
|
Name |
Grade No |
EEW (g/eq) |
N.V. (%) |
Viscosity (mPa.s) |
|
Tetrafunctional epoxy resin solution |
DFE251 |
200-240 |
70 士 1 |
50-250 |
Crystalline/liquid crystal epoxy resin series
Crystalline (liquid crystal) epoxy resin has the characteristics of low viscosity, heat resistance, high fluidity, low coefficient of linear expansion and low water absorption, which is widely used in electronic copper clad laminate, composite materials and other fields.
DFE260
DFE261
DFE262
DFE264
|
Name |
Grade No |
EEW (g/eq) |
melting /softening point (°C) |
Hy-Cl (ppm) |
properties |
|
Biphenyl phenolic epoxy resin |
DFE260 |
280-300 |
65-75 |
<300 |
Low dielectric, high heat resistance |
|
Biphenyl Liquid Crystalline Epoxy resin |
DFE261 |
184-192 |
>100 |
<300 |
Low viscosity, high thermal conductivity |
|
BHQBiphenyl Crystalline Epoxy resin |
DFE262 |
168-180 |
>136 |
<300 |
Low viscosity, flame retardant |
|
Tetramethylbisphenol F epoxy resin |
DFE264 |
190-210 |
>69 |
<300 |
Low viscosity, low dielectric |
Phenol Formaldehyde Resin series
Linear phenolic resin is a fine and high-purity phenolic resin developed for electronic materials industry. It is characterized by light color, narrow molecular weight distribution and low free phenol content (the lowest can be reduced to l00ppm). It is widely used in electronic copper clad laminate, semiconductor packaging and other fields. In addition, while providing customers with specific softening point products, our company can also provide resin butanone solution with solid content of 60% – 70% according to the demand.
|
Name |
Grade No |
Appearance |
softening point (°C) |
Free Phenol (%) |
Non Volatile Content (%) |
hydroxyl equivalent (g/eq) |
|
Phenol Formaldehyde Resin |
DFE308 |
Colorless to light yellow transparent solid |
84 土 3 |
<0.05 |
≥ 99.5 |
106±2 |
|
DFE309 |
95±3 |
<0.05 |
≥ 99.5 |
106±2 |
||
|
DFE310 DFE311 |
98±3 |
≤0.1 |
≥ 99.5 |
106±3 |
||
|
105 ±3 |
≤0.1 |
≥99.5 |
106±3 |
|||
|
DFE312 |
115±3 |
≤0.1 |
≥99.5 |
106±3 |
||
|
BP A type phenolic resin |
DFE322 |
Yellowish to brownish red solid |
122 ±3 |
≤0.1 |
≥99.5 |
118±3 |
Phosphorus containing phenolic resin series
Phosphorus containing phenolic resin has high phosphorus content and good flame retardancy, which can make up for the deficiency of low phosphorus content in phosphorus containing epoxy resin. It is suitable for electronic copper clad laminate, capacitor packaging, electrical laminate and other fields.
|
Name |
Grade No |
Appearance |
N.V. (%) |
P% (%) |
Viscosity (cps) |
hydroxyl equivalent (g/eq) |
properties |
|
Phosphorus contaming phenolic resin |
DFE392 |
Yellow transparent liquid |
60 ±1.0 |
8.9 〜9.2 |
400—3000 |
360〜400 |
Good flame retardancy |
|
DFE394 |
Yellow transparent liquid |
60 ±1.0 |
8.9 〜9.2 |
3000〜5000 |
320〜360 |
High activity and flame retardancy |
|
|
DFE395 |
Yellow transparent liquid |
56±1,0 |
8.9 〜9.2 |
1000〜4000 |
320〜360 |
High activity and flame retardancy |
|
|
D992-2 |
Yellow to brown transparent |
60 ±1,0 |
8,6 〜8.8 |
400—3000 |
320〜360 |
Low cost, good flame retardant |
|
|
D994 |
Yellow transparent liquid |
60 ±1,0 |
8.9 〜9.2 |
400〜3000 |
320〜360 |
High activity and flame retardancy |
Modified hydrocarbon resin series
Hydrocarbon resin series is an important kind of high frequency circuit substrate resin in 5g field. Because of its special chemical structure, it generally has low dielectric, excellent heat resistance and chemical stability. It is mainly used in 5g copper clad laminates, laminates, flame retardant materials, high temperature resistant insulating paint, adhesives and casting materials. The products include modified hydrocarbon resin and hydrocarbon resin composition.
Modified hydrocarbon resin is a kind of hydrocarbon resin obtained by our company through modification of hydrocarbon raw materials. It has good dielectric properties, high vinyl content, high peel strength, etc., and is widely used in high frequency materials.
|
Name |
Grade No |
Appearance |
N.V. (%) |
Viscosity (mPa.s) |
properties |
|
Modified styrene butadiene resin |
DFE401 |
Light yellow liquid |
35±2.0 |
<3000 |
High molecular weight and low dielectric. Mainly used in hydrocarbon resin, polyphenylene ether and peek resin system |
|
Epoxy resin modified styrene butadiene resin |
DFE402 |
Colorless to yellowish liquid |
60±2.0 |
<5000 |
Anhydride modified epoxy with low dielectric properties is mainly used in high-speed materials |
|
Styrene butadiene resin with low dielectric properties |
DFE403 |
60±2.0 |
<2000 |
High vinyl content, high crosslinking density, mainly used in hydrocarbon resin, polyphenylene ether and peek resin system |
|
|
Modified hydrocarbon resin |
DFE404 |
40+2.0 |
<2000 |
Low dielectric, low water absorption, high peel strength |
|
|
Modified polystyrene resin |
DFE405 |
60 土 2.0 |
<3000 |
High vinyl content, high crosslinking density, mainly used in hydrocarbon resin, polyphenylene ether and peek resin system |
|
|
Modified hydrocarbon resin |
DFE406 |
35±2.0 |
<2000 |
Low water absorption, high peel strength, better dielectric properties |
|
|
hydrocarbon resin |
DFE412 |
Light yellow liquid |
50 土 2.0 |
<8000 |
High modulus, high molecular weight and low dielectric |
|
Double bond resin with low dielectric properties |
DFE416 |
Colorless to yellowish liquid |
60+2.0 |
<2000 |
High vinyl content, high crosslinking density, mainly used in hydrocarbon resin, polyphenylene ether and peek resin system |
Hydrocarbon resin composition series
Hydrocarbon resin composite is a kind of hydrocarbon resin composite developed by our company for 5g communication. After dipping, drying, laminating and pressing, the composite has excellent dielectric properties, high peel strength, good heat resistance and good flame retardancy. It is widely used in 5g base station, antenna, power amplifier, radar and other high- frequency materials.carbon resin obtained by our company through modification of hydrocarbon raw materials. It has good dielectric properties, high vinyl content, high peel strength, etc., and is widely used in high frequency materials.
|
Name |
Grade No |
Appearance |
N.V. (%) |
properties |
|
Hydrocarbon resin composition |
DFE407 |
White to yellowish liquid |
65 ±2.0 |
Dk/Df： 3.48/0.0037 Mainly used in power amplifier (V0) |
|
DFE407A |
65 ±2.0 |
Dk: 3.52 High fluidity, mainly used in the production of adhesive sheet |
||
|
DFE408 |
65 ±2.0 |
Dk/Df： 3.00/0.0027 Mainly used in base station and antenna (multilayer board， flame retardant V0) |
||
|
DFE408A |
65 ±2.0 |
Dk: 3.00 High fluidity, mainly used in the production of adhesive sheet |
||
|
DFE409 |
65 ±2.0 |
Dk/Df： 3.30/0.0027 Mainly used in antenna (double-sided board, non flame retardant V0) |
||
|
DFE410 |
65 ±2.0 |
Dk/Df： 3.40/0.0029 Mainly used in antenna (double-sided board, non flame retardant V0) |
||
|
DFE411 |
65 土 2.0 |
Dk/Df： 3.38/0.0027 Mainly used in power amplifier (non flame retardant) |
Active Ester
he active ester curing agent reacts with epoxy resin to form a grid without secondary alcohol hydroxyl group. The curing system has the characteristics of low water absorption and low Dk / Df.
|
Name |
Grade No |
appearance |
Ester equivalent |
N.V. (%) |
Viscosity (卬s) |
softening point rc) |
|
Low dielectric active ester curing agent |
DFE607 |
Light brown viscous liquid |
230〜240 |
69 ±1.0 |
1400〜1800 |
140〜150 |
|
DFE608 |
Brownish red liquid |
275-290 |
69±1.0 Available solids |
800-1200 |
140-150 |
|
|
DFE609 |
Brown liquid |
275-290 |
130-140 |
|||
|
DFE610 |
Brown liquid |
275-290 |
100-110 |
Special Resin Monomer
The content of phosphorus is more than 13%, the content of nitrogen is more than 6%, and the hydrolysis resistance is excellent. It is suitable for electronic copper clad laminate, capacitor packaging and other fields.
BIS-DOPO ethane is a kind of phosphate organic compounds, halogen-free environmental flame retardant. The product is white powder solid. The product has very good thermal stability and chemical stability, and the thermal decomposition temperature is above 400 °C. This product is highly efficient flame retardant and environmentally friendly. It can fully meet the environmental requirements of the European Union. It can ~be used as a flame retardant in the field of copper clad laminate. In addition, the product has excellent compatibility with polyester and nylon, so it has excellent spinnability in the spinning process, good continuous spinning and coloring properties, and is also widely used in the field of polyester and nylon.
|
Name |
Grade No |
Appearance |
melting point （℃） |
P% % |
N% (%) |
Td5%（℃） |
Properties |
|
Phosphazene flame retardant |
DFE790 |
Earthy white or yellow powder |
108 ±4.0 |
≥13 |
≥6 |
≥320 |
High phosphoms content, flame retardant, high heat resistance, hydrolysis resistance, suitable for copper clad laminate and other fields |
|
Name |
Grade No |
Appearance |
content % |
melting point CC) |
P% % |
Td2% V |
Properties |
|
BIS-DOPO ethane |
DFE791 |
White powder |
≥99 |
290-295 |
≥13 |
≥400 |
Chloride ion content < 20ppm, high melting point, high cracking tenperature, low e^ansion coefficient |
Maleimide Resin series
DFE930n DFE936> DFE937, DFE939^ DFE950 and DFE952 are all electronic grade maleimide resins with high purity, less impurities and good solubility. Due to the imine ring structure in the molecule, they have strong rigidity and excellent heat resistance. They are widely used in aerospace structural materials，carbon fiber high temperature resistant structural parts，high temperature resistant impregnating paint, laminates, copper clad laminates, molded plastics, etc High grade printed circuit “board, wear-resistant materials, diamond wheel adhesive, magnetic materials, casting parts and other iunctional materials and other high-tech fields.
|
Name |
Grade NO |
Appearance |
Melting point (℃) |
Acid Value ( mg KOH/g) |
Volatile content (%) |
(5mm) Solubility of hot toluene (5min) |
Properties |
|
Electrical grade Bismaleimide |
DFE928 |
Yellow solid particles |
158±2 |
≤3.0 |
≤0.3 |
Fully soluble |
High heat resistance |
|
Electronic grade diphenylmethane Bismaleimide |
DFE929 |
Light yellow solid particles |
162 ±2 |
≤1.0 |
≤0.3 |
High purity and low acid value |
|
|
Electronic grade Bismaleimide |
DFE930 |
Light yellow white powder |
160 ±2 |
≤1.0 |
≤0.3 |
High purity aad low acid^lue |
|
|
Low crystalline Bismaleimide |
DFE936 |
168 ±2 |
≤1.0 |
≤0.3 |
Good solubility |
||
|
Low crystalline and low dielectric Bismaleimide |
DFE937 |
168 ±2 |
≤1.0 |
≤0.3 |
Good solubility |
||
|
Phenyl bismaleimide with low melting point |
DFE939 |
Light brown solid or yellow solid powder |
50 土 10 |
≤3.0 |
≤0.3 |
Good solubility |
|
|
Low melting point polymaleimide |
DFE950 |
50 ±10 |
≤3.0 |
≤0.3 |
Good solubility |
||
|
Low meltmg point tetramaleirnide |
DFE952 |
50 ±10 |
≤3.0 |
≤0.3 |
Good solubility |
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