Sichuan EM Technology Co., Ltd. ( EMT ) is a professional global material manufacturer, committed to introducing safe and eco-friendly material solutions to create a better quality of life for society.
Our insulation film, optical film, mica tape, resin and other products widely serve UHV power, wind power, Solar power, 5G communication, consumer electronics, home appliances and other fields. The good quality of products and services is well-known in the industry.
After years of research & development and layout, we have achieved great success in high-performance BMI resin products for Copper Clad Laminates.
Product Name: BMI Resin (Maleamide Resin).
Grades: DFE936, DFE950
1.DFE936
This product is a low crystalline thermosetting resin monomer, can be used as a heat-resistant modifier of epoxy resin, which has a short chain substituent that helps to increase the molecular spacing, thereby weakening the crystallinity of the resin, improving solubility, solving the problem of poor solubility of ordinary double maleimide resin, for the preparation of high-grade printed circuit boards, F-class insulation materials, high-performance abrasion-resistant materials, etc.
Performance parameters:
|
serial number |
Metric name |
unit |
Test conditions |
The metric value |
Typical values |
|
1 |
Appearance |
/ |
Naked eye observation |
White solid powder |
White solid powder |
|
2 |
Melting point |
℃ |
DSC，10℃/min，N2 |
160—170 |
168 |
|
3 |
Acid |
mg KOH/g |
HG/T 2708-1995 |
＜1.0 |
0.3~0.5 |
|
4 |
Content |
wt% |
HPLC |
≥97 |
98.1~98.4 |
Applications:
1.1 The product can be copolymerized with diallyl bisphenol A as a composite matrix resin, which is resistant to high temperature, radiation and high strength.
1.2 The product can be modified with ordinary epoxy resin for the preparation of insulation materials, high-temperature adhesives, etc., and the products are resistant to high temperatures, good insulation and good toughness after composite.
1.3 The product has soluble and meltable characteristics, and can be used to coat or impregnate fiber materials, etc., suitable for large components.
2. DFE 950
This product is a low melting point thermosetting resin, can be used as a heat-resistant modifier of epoxy resin, its structure of multiple maleimide structure weakens the crystallinity of the resin, improve solubility, solves the problem of poor solubility of ordinary double maleimide resin, can be directly glued for the preparation of high-grade printed circuit board, F-class insulation materials, high-performance abrasion-resistant materials, etc.
Properties:
|
serial number |
Metric name |
unit |
Test conditions |
The metric value |
Typical values |
|
1 |
Appearance |
－ |
In well-lit areas, observe with the naked eye |
Brownish yellow solid |
Brownish yellow solid |
|
2 |
Softening points |
℃ |
Globe Law |
75~90 |
80~85 |
|
3 |
Acid |
mg KOH/g |
HG/T 2708-1995 |
＜3.0 |
1.0~1.5 |
|
4 |
Solubility |
－ |
25℃，50wt% DMF/MEK（wt/wt=1:1） |
Clear and transparent |
Clear and transparent |
Applications
2.1 Products can be copolymerized with diallyl bisphenol A, cyanate, amine curing agent, polyphenylene ether, etc. as base resin for compound materials, which are resistant to high temperature, radiation and high strength.
2.2 The product can be modified with ordinary epoxy resin, which is used to prepare insulation materials, high-temperature adhesives, etc., and the products are resistant to high temperature, good insulation and good toughness after composite.
2.3 The product has soluble and meltable characteristics, and can be used to coat or impregnate fiber materials, etc., suitable for large components.
DFE936 & DFE950 are good choices for the preparation of carrier plates, plate-like carriers and high-speed CCLs.
Please contact us, let us help you rocket your CCL businesses.
Contact person: Mr. Feng, fengjing@emtco.com
Post time: Jun-07-2022
