Global Supplier of Environmental Protection
And Safety New Material Solutions
Specific Electronic Resin
Applications Images
Our company is the first company to realize the mass industrial production of Benzoxazine Resin in China, and is in the leading position in the production, application and research fields of Benzoxazine Resin. Benzoxazine Resin products of our company have passed SGS detection, and they do not contain halogen and RoHS (Pb, CD, Hg, Gr (VI), PBBs, PBDEs) harmful substances. The characteristic is that there is no small molecule released during the curing process and the volume is almost zero shrinkage; The curing products have the characteristics of low water absorption, low surface energy, good UV resistance, excellent heat resistance, high residual carbon, no need of strong acid catalysis and open-loop curing.lt is widely used in electronic copper clad laminates, laminates, composite materials, aerospace materials, friction materials and other fields.
|
Name |
Grade No |
Appearance |
softening point (°C) |
Free Phenol (%) |
GT (s @210℃） |
Viscosity |
N.V. (%) |
properties |
|
MDA type Benzoxazine |
DFE125 |
Brownish red transparent liquid |
- |
≤ 5 |
100-230 |
30-70 (s,4# 杯） |
70±3 |
High Tg, high heat resistance, halogen-free flame retardant, high strength and toughness |
|
BPA type Benzoxazine |
DFE127 |
Yellow transparent liquid |
- |
≤ 5 |
1100-1600 |
200-800 Mpa·s |
80 土 2 |
High modulus, high heat resistance, halogen-free flame retardant, low water absorption |
|
BPA type Benzoxazine |
DFE127A |
Yellow solid |
60-85 |
≤ 5 |
500-800 |
- |
98±1,5 |
High modulus, high heat resistance, halogen-free flame retardant, low water absorption |
|
BPF type Benzoxazine |
DFE128 |
Brownish red transparent liquid |
- |
≤ 5 |
350-400 |
30-100 (s，4# 杯） |
75±2 |
Good toughness, high heat resistance, halogen-free flame retardant, low water absorption and low viscosity |
|
ODA type Benzoxazine |
DFE129 |
Brownish red transparent |
- |
≤ 2 |
120-500 |
<2000 mpa.s |
65 土 3 |
Tg: 212°C, Free PlienoK≤ 2%， Dk： 2.92, Df： 0.0051 |
Low dielectric Benzoxazine Resin is a kind of Benzoxazine Resin developed for high frequency and high speed copper clad laminate. This kind of resin has the characteristics of low Dk / DF and high heat resistance. It is widely used in M2, M4 grade copper clad laminate or HDI board, multilayer board, composite materials, friction materials, aerospace materials and other fields.
|
Name |
Grade No |
Appearance |
softening point rc> |
Free Phenol (%) |
GT (s @210℃） |
Viscosity |
N.V. (%) |
properties |
|
Low dielectric benzoxazine |
DFE130 |
Yellow granular or massive solid |
55-80 |
≤ 5 |
400-600 |
— |
≥98.5 |
Dk: 2.75、Tg:196℃： |
|
Rapid curing of benzoxazine at medium and low temperature |
DFE146 |
Brownish yellow transparent liquid |
- |
≤ 5 |
100-130 |
<200 (s，4# 杯） |
75±2 |
Dk： 3.04, Df： 0.0039 High curing speed, high Tg and low dielectric |
|
Benzoxazine with double bond |
DFE148 |
Brownish red transparent liquid |
- |
≤ 5 |
Actual measurement |
<2000 Mpa·s |
80±2 |
It can react with other resins containing double bond |
|
Main chain benzoxazine |
DFE149 |
Brownish yellow transparent liquid |
- |
≤ 3 |
80-160 |
<2000 Mpa·s |
70 土 2 |
Tg： 215#C, Td5%： 380°C, Dk： 2.87, Df： 0.0074 (10GHz) |
|
DCPD type Benzoxazine |
DFE150 |
Reddish brown transparent liquid |
- |
≤ 3 |
2000-2500 |
<1000 Mpa·s |
75±2 |
Dk： 2.85, Df： 0.0073 (10GHz) |
|
Bisphenol benzoxazine |
DFE153 |
Brownish yellow transparent liquid |
一 |
≤ 3 |
100-200 |
<2000 Mpa·s |
70±2 |
Dk： 2.88, Df： 0.0076 (10GHz) , |
Hydrocarbon resin series is an important kind of high frequency circuit substrate resin in 5g field. Because of its special chemical structure, it generally has low dielectric, excellent heat resistance and chemical stability. It is mainly used in 5g copper clad laminates, laminates, flame retardant materials, high temperature resistant insulating paint, adhesives and casting materials. The products include modified hydrocarbon resin and hydrocarbon resin composition.
Modified hydrocarbon resin is a kind of hydrocarbon resin obtained by our company through modification of hydrocarbon raw materials. It has good dielectric properties, high vinyl content, high peel strength, etc., and is widely used in high frequency materials.
|
Name |
Grade No |
Appearance |
N.V. (%) |
Viscosity (mPa.s) |
properties |
|
Modified styrene butadiene resin |
DFE401 |
Light yellow liquid |
35±2.0 |
<3000 |
High molecular weight and low dielectric. Mainly used in hydrocarbon resin, polyphenylene ether and peek resin system |
|
Epoxy resin modified styrene butadiene resin |
DFE402 |
Colorless to yellowish liquid |
60±2.0 |
<5000 |
Anhydride modified epoxy with low dielectric properties is mainly used in high-speed materials |
|
Styrene butadiene resin with low dielectric properties |
DFE403 |
60±2.0 |
<2000 |
High vinyl content, high crosslinking density, mainly used in hydrocarbon resin, polyphenylene ether and peek resin system |
|
|
Modified hydrocarbon resin |
DFE404 |
40+2.0 |
<2000 |
Low dielectric, low water absorption, high peel strength |
|
|
Modified polystyrene resin |
DFE405 |
60 土 2.0 |
<3000 |
High vinyl content, high crosslinking density, mainly used in hydrocarbon resin, polyphenylene ether and peek resin system |
|
|
Modified hydrocarbon resin |
DFE406 |
35±2.0 |
<2000 |
Low water absorption, high peel strength, better dielectric properties |
|
|
hydrocarbon resin |
DFE412 |
Light yellow liquid |
50 土 2.0 |
<8000 |
High modulus, high molecular weight and low dielectric |
|
Double bond resin with low dielectric properties |
DFE416 |
Colorless to yellowish liquid |
60+2.0 |
<2000 |
High vinyl content, high crosslinking density, mainly used in hydrocarbon resin, polyphenylene ether and peek resin system |
Hydrocarbon resin composite is a kind of hydrocarbon resin composite developed by our company for 5g communication. After dipping, drying, laminating and pressing, the composite has excellent dielectric properties, high peel strength, good heat resistance and good flame retardancy. It is widely used in 5g base station, antenna, power amplifier, radar and other high- frequency materials.carbon resin obtained by our company through modification of hydrocarbon raw materials. It has good dielectric properties, high vinyl content, high peel strength, etc., and is widely used in high frequency materials.
|
Name |
Grade No |
Appearance |
N.V. (%) |
properties |
|
Hydrocarbon resin composition |
DFE407 |
White to yellowish liquid |
65 ±2.0 |
Dk/Df： 3.48/0.0037 Mainly used in power amplifier (V0) |
|
DFE407A |
65 ±2.0 |
Dk: 3.52 High fluidity, mainly used in the production of adhesive sheet |
||
|
DFE408 |
65 ±2.0 |
Dk/Df： 3.00/0.0027 Mainly used in base station and antenna (multilayer board， flame retardant V0) |
||
|
DFE408A |
65 ±2.0 |
Dk: 3.00 High fluidity, mainly used in the production of adhesive sheet |
||
|
DFE409 |
65 ±2.0 |
Dk/Df： 3.30/0.0027 Mainly used in antenna (double-sided board, non flame retardant V0) |
||
|
DFE410 |
65 ±2.0 |
Dk/Df： 3.40/0.0029 Mainly used in antenna (double-sided board, non flame retardant V0) |
||
|
DFE411 |
65 土 2.0 |
Dk/Df： 3.38/0.0027 Mainly used in power amplifier (non flame retardant) |
he active ester curing agent reacts with epoxy resin to form a grid without secondary alcohol hydroxyl group. The curing system has the characteristics of low water absorption and low Dk / Df.
|
Name |
Grade No |
appearance |
Ester equivalent |
N.V. (%) |
Viscosity (卬s) |
softening point rc) |
|
Low dielectric active ester curing agent |
DFE607 |
Light brown viscous liquid |
230〜240 |
69 ±1.0 |
1400〜1800 |
140〜150 |
|
DFE608 |
Brownish red liquid |
275-290 |
69±1.0 Available solids |
800-1200 |
140-150 |
|
|
DFE609 |
Brown liquid |
275-290 |
130-140 |
|||
|
DFE610 |
Brown liquid |
275-290 |
100-110 |
The content of phosphorus is more than 13%, the content of nitrogen is more than 6%, and the hydrolysis resistance is excellent. It is suitable for electronic copper clad laminate, capacitor packaging and other fields.
BIS-DOPO ethane is a kind of phosphate organic compounds, halogen-free environmental flame retardant. The product is white powder solid. The product has very good thermal stability and chemical stability, and the thermal decomposition temperature is above 400 °C. This product is highly efficient flame retardant and environmentally friendly. It can fully meet the environmental requirements of the European Union. It can ~be used as a flame retardant in the field of copper clad laminate. In addition, the product has excellent compatibility with polyester and nylon, so it has excellent spinnability in the spinning process, good continuous spinning and coloring properties, and is also widely used in the field of polyester and nylon.
|
Name |
Grade No |
Appearance |
melting point （℃） |
P% % |
N% (%) |
Td5%（℃） |
Properties |
|
Phosphazene flame retardant |
DFE790 |
Earthy white or yellow powder |
108 ±4.0 |
≥13 |
≥6 |
≥320 |
High phosphoms content, flame retardant, high heat resistance, hydrolysis resistance, suitable for copper clad laminate and other fields |
|
Name |
Grade No |
Appearance |
content % |
melting point CC) |
P% % |
Td2% V |
Properties |
|
BIS-DOPO ethane |
DFE791 |
White powder |
≥99 |
290-295 |
≥13 |
≥400 |
Chloride ion content < 20ppm, high melting point, high cracking tenperature, low e^ansion coefficient |
DFE930n DFE936> DFE937, DFE939^ DFE950 and DFE952 are all electronic grade maleimide resins with high purity, less impurities and good solubility. Due to the imine ring structure in the molecule, they have strong rigidity and excellent heat resistance. They are widely used in aerospace structural materials，carbon fiber high temperature resistant structural parts，high temperature resistant impregnating paint, laminates, copper clad laminates, molded plastics, etc High grade printed circuit "board, wear-resistant materials, diamond wheel adhesive, magnetic materials, casting parts and other iunctional materials and other high-tech fields.
|
Name |
Grade NO |
Appearance |
Melting point (℃) |
Acid Value ( mg KOH/g) |
Volatile content (%) |
(5mm) Solubility of hot toluene (5min) |
Properties |
|
Electrical grade Bismaleimide |
DFE928 |
Yellow solid particles |
158±2 |
≤3.0 |
≤0.3 |
Fully soluble |
High heat resistance |
|
Electronic grade diphenylmethane Bismaleimide |
DFE929 |
Light yellow solid particles |
162 ±2 |
≤1.0 |
≤0.3 |
High purity and low acid value |
|
|
Electronic grade Bismaleimide |
DFE930 |
Light yellow white powder |
160 ±2 |
≤1.0 |
≤0.3 |
High purity aad low acid^lue |
|
|
Low crystalline Bismaleimide |
DFE936 |
168 ±2 |
≤1.0 |
≤0.3 |
Good solubility |
||
|
Low crystalline and low dielectric Bismaleimide |
DFE937 |
168 ±2 |
≤1.0 |
≤0.3 |
Good solubility |
||
|
Phenyl bismaleimide with low melting point |
DFE939 |
Light brown solid or yellow solid powder |
50 土 10 |
≤3.0 |
≤0.3 |
Good solubility |
|
|
Low melting point polymaleimide |
DFE950 |
50 ±10 |
≤3.0 |
≤0.3 |
Good solubility |
||
|
Low meltmg point tetramaleirnide |
DFE952 |
50 ±10 |
≤3.0 |
≤0.3 |
Good solubility |
